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AGT-028
AG Termopasty

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Easy Print Sn96,5Ag3Cu0,5

Paste designed for soldering SMD components in production processes that do not include washing phase.

It is based on a ‘no clean’ flux type, that does not require cleaning and its residues do not cause corrosion centres.

The product cooperates with all the lead free alloys, it exhibits good tackiness and wettability of soldered surface.

It does not lose its physical and chemical properties even after being left for 20 hours on the PCB.

This time depends on conditions in room: humidity and temperature.

Additional properties of the paste:
it contains rosin-based flux , presence of activator that prevents the forming of air bubbles in the soldered joints, joints have very good mechanical and electrical properties.
If the process includes the washing phase, this can be done with commonly available agents (Water based PCB cleaner, Alcohol based PCB cleaner).

Application:
electronics, electrotechnics
automatic soldering
manual soldering
surface mounting
for automatic PCBs, for manual PCBs

 

Solder type for soft soldering
Shape paste
Alloy composition Sn96,5Ag3Cu0,5
Flux type No Clean
Melting point 217°C
Grain size 25...45 µm
Properties lead free; 
residues need no cleaning; 
residues can be cleaned with alcohol-based agents

 
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