Thermally conductive adhesive
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1.0 W/m·K
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8x1011 Ω/cm
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118°C cm/W
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-50 °C ... +145 °C
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approx. 30 min
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25 °C approx. 4 h / 50 °C approx. 1 h / 85 °C approx. 10 min / 125 °C approx. 2 min
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Epoxid
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1:1
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To stick electronic building parts or mechanical components safely while maintaining thermal conductivity, Fischer Elektronik announces the launch of its new, thermally conductive adhesive, WLK DK – a temperature and impact-resistant, two-component adhesive, with short pot life. It is solvent-free, and thermal conductivity is guaranteed by the aluminium oxide filling based on epoxy resin. The thermally conductive adhesive can be used to stick porous and non-porous surfaces: metals, glass, ceramic materials and almost all plastic materials. Hardener and binder are mixed (ratio 1:1) using a static mixing tube with Luer Lock system. In the standard version, the thermally conductive adhesive is available as a 4 ml and a 10 ml syringe and as a 50 ml cartridge
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