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WLK-DK4
Fischer
--- κατόπιν παραγγελίας
15,00 €

Thermally conductive adhesive

thermal conductivity
1.0 W/m·K
pass resistance
8x1011 Ω/cm
Rth
118°C cm/W
temperature range
-50 °C ... +145 °C
working life at room temperature
approx. 30 min
hardening time
25 °C approx. 4 h / 50 °C approx. 1 h / 85 °C approx. 10 min / 125 °C approx. 2 min
glue layer
Epoxid
mixture proportion
1:1

To stick electronic building parts or mechanical components safely while maintaining thermal conductivity, Fischer Elektronik announces the launch of its new, thermally conductive adhesive, WLK DK – a temperature and impact-resistant, two-component adhesive, with short pot life. It is solvent-free, and thermal conductivity is guaranteed by the aluminium oxide filling based on epoxy resin. The thermally conductive adhesive can be used to stick porous and non-porous surfaces: metals, glass, ceramic materials and almost all plastic materials. Hardener and binder are mixed (ratio 1:1) using a static mixing tube with Luer Lock system. In the standard version, the thermally conductive adhesive is available as a 4 ml and a 10 ml syringe and as a 50 ml cartridge

 
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