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ICK BGA 23 x 23
Fischer Elektronik

Κατόπιν παραγγελίας

ζητήστε προσφορά!
way of fixation
  • therm. conductive foil
  • therm. cond. adhesive
socket
universal
suitable for processor type
universal
width
23 mm
height
6 mm
plate thickness
1.8 mm
length
23 mm
thermal resistance Rth
22.5 - 6.5 K/W
dissipation loss Pv
2.8 W
surface
black anodised

ick_bga23x23.eps

 
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