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38,1 x 37,92 x 16,5 mm, for IC design PGA and others

way of fixation	therm. cond. adhesive therm. conductive foil
socket	universal
suitable for processor type	universal
width	38.1 mm
height	16.51 mm
plate thickness	3.5 mm
length	37.92 mm
thermal resistance Rth	9.4 - 2.1 K/W
dissipation loss Pv	5.9 W
surface	black anodised