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Ø 28,5 x 10 mm, pin heatsinks round

design	round
way of fixation	therm. conductive foil therm. cond. adhesive
socket	universal
suitable for processor type	universal
diameter Ø	28.5 mm
height	10 mm
plate thickness	3 mm
weight	5.16 g
thermal resistance Rth	5.65 - 2.8 K/W
dissipation loss Pv	16 W
surface	Al-natural