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Ø 28,5 x 18,5 mm, pin heatsinks round

design	round
way of fixation	therm. conductive foil therm. cond. adhesive
socket	universal
suitable for processor type	universal
diameter Ø	28.5 mm
height	18.5 mm
plate thickness	3 mm
weight	6.98 g
thermal resistance Rth	4.25 - 1.7 K/W
dissipation loss Pv	20.2 W
surface	Al-natural