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Ø 36,5 x 20 mm, pin heatsinks round

design	round
way of fixation	therm. conductive foil therm. cond. adhesive
socket	universal
suitable for processor type	universal
diameter Ø	36.5 mm
height	20 mm
plate thickness	3.5 mm
weight	17.59 g
thermal resistance Rth	6.41 - 1.4 K/W
dissipation loss Pv	18 W
surface	Al-natural